NVIDIA H200

1. Product Overview

The NVIDIA H200 (codename: GH200) is the final flagship GPU based on the Hopper architecture, unveiled by NVIDIA at SC23 in 2023 and launched for mass production in Q2 2024. It is the world’s first GPU equipped with HBM3e memory.

Positioning: Primary accelerator for 7B–70B LLM training, high-concurrency inference for 13B–70B large language models, the preferred upgrade solution for H100 clusters, and the most cost-effective mainstream flagship GPU in the current market.

Architecture: Hopper (enhanced version of GH100, single-die design)

Process Technology: TSMC 4nm process

Memory: 141GB HBM3e (double the memory capacity of H100)

Form Factor: Dual versions including SXM5 liquid-cooled model and PCIe air-cooled model

Product Position: Predecessor of B200/B300 series, and a direct upgrade and replacement for the H100 GPU

2. Detailed Specifications of Single H200 GPU

2.1 Architecture & Process Technology

Architecture: Hopper (GH200, single-die)

Process Technology: TSMC 4nm

Transistor Count: Approximately 80 billion

2.2 Computing Cores

Streaming Multiprocessors (SMs): 132

CUDA Cores: 16,896

4th-Generation Tensor Cores: 528

Supported Precision Formats: FP8, FP16, BF16, TF32 (FP4 is not supported)

2.3 Memory System

Memory Capacity: 141GB HBM3e

Memory Bus Width: 8192-bit

Memory Bandwidth: 4.8 TB/s

ECC Support: Full-capacity ECC enabled

MIG Partitioning: Maximum 7 independent instances (18GB memory per instance)

2.4 Single-Card Dense Computing Performance

FP8 (Training): 3.94 PFLOPS

FP16/BF16: 1.97 PFLOPS

INT8: 3.94 TOPS

2.5 Interconnection & Interfaces

NVLink 4.0: 450GB/s unidirectional bandwidth, 900GB/s bidirectional bandwidth

PCIe Gen5: 128GB/s bandwidth

Interface Types: SXM5 (liquid-cooled) / PCIe (air-cooled)

2.6 Power Consumption & Thermal Dissipation

Total Graphics Power (TGP): 700W (SXM version) / 600W (PCIe version)

Cooling Solution: Liquid cooling for SXM model; air cooling / cold plate cooling for PCIe model

3. DGX H200 (8-GPU Server) Full Specifications

3.1 Hardware Configuration

GPU Configuration: 8 × H200 SXM5 GPUs, with a total HBM3e memory of 1,128GB

CPU Configuration: Dual Intel Xeon Platinum 8480C processors (56 cores per CPU)

System Memory: 2TB DDR5 (expandable up to 4TB)

NVSwitch: 4 × 4th-generation NVSwitch, with aggregated bandwidth of 7.2TB/s

Network Configuration: 10 × ConnectX-7 400G InfiniBand / Ethernet ports

Storage Configuration: 8 × E1.S 3.84TB NVMe SSDs (total storage of 30.72TB)

Total System Power Consumption: Approximately 8kW

Chassis Specification: 10U rack-mounted, liquid-cooled chassis

3.2 Overall System Computing Performance

FP8 Training Performance: 31.5 PFLOPS

FP16 Computing Performance: 15.7 PFLOPS

INT8 Computing Performance: 31.5 TOPS

____________________________________________________________

NVIDIA  B300
NVIDIA  B200
NVIDIA  H200
NVIDIA  H100

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