Lam Research 853-203016-172

Product Overview

Lam Research 810-800081-022 and 810-800082-201 are professional industrial electronic assemblies for semiconductor manufacturing equipment. Built for VME-based control systems in advanced wafer processing devices, they deliver core backplane connection, signal routing and module communication functions.

The 810-800081-022 is a VME Backplane PCB Assembly. It acts as a high-density connection platform to realize signal transmission and power distribution between multiple VME control boards. The 810-800082-201 serves as a VME Breakout Assembly, bridging signal transmission and interface access between internal control circuits and external device wiring.

Combined, the two components ensure stable operation of Lam Research semiconductor process tools and enable convenient modular maintenance. They are widely applied in semiconductor equipment maintenance, part replacement and device refurbishment scenarios that require reliable VME system performance.

Technical Specifications

Lam Research 810-800081-022

Parameter	Description
Manufacturer	Lam Research
Part Number	810-800081-022
Product Type	VME Backplane PCB Assembly
Board Category	Control System Backplane
Core Function	VME module interconnection and signal distribution
Application	Semiconductor Processing Equipment
PCB Type	Multi-layer Industrial PCB
Interface Architecture	VME Bus System
Material	Industrial PCB substrate
Installation Location	Equipment Control Rack
Usage	Replacement / Maintenance Spare Parts

Lam Research 810-800082-201

Parameter	Description
Manufacturer	Lam Research
Part Number	810-800082-201
Product Type	VME Breakout Assembly
Main Function	Signal breakout and interface conversion
Application	Semiconductor Manufacturing Equipment
System Architecture	VME Control Platform
Assembly Type	Electronic Interface Board
Installation	Lam Research Equipment Controller
Usage	Equipment Repair and Replacement

Functional Description

810-800081-022 VME Backplane Functions

This VME Backplane PCB serves as the core interconnection hub of Lam Research control systems. It provides physical and electrical channels for real-time communication between all VME modules in the equipment rack, integrating discrete control boards into a unified operating system.

Core functions:

• Establish stable VME bus communication channels
• Distribute power evenly among all installed modules
• Maintain high-stability signal transmission
• Support modular controller expansion and upgrade
• Connect CPU, I/O and various interface boards

810-800082-201 VME Breakout Assembly Functions

The breakout assembly acts as a transition interface between internal VME control circuits and external equipment wiring. It standardizes signal access and simplifies system wiring for efficient equipment operation and maintenance.

Core functions:

• Realize signal access and centralized distribution
• Simplify complex equipment wiring connections
• Facilitate daily troubleshooting and routine maintenance
• Provide standardized interface points for control signals

Its optimized breakout design enables technicians to quickly diagnose signal faults and replace modules, effectively reducing equipment downtime.

Standard Installation Procedure

1. Safely shut down the semiconductor equipment and cut off the power supply
2. Remove the old backplane or breakout assembly
3. Install the new replacement module in place
4. Check and fasten all connectors and mounting points
5. Power on the device and complete system diagnostic tests

Daily Maintenance Recommendations

• Regularly inspect connectors for oxidation and mechanical damage
• Keep the control cabinet clean and dry
• Implement standard ESD protection during component handling
• Real-time monitor equipment communication alarm data
• Store spare boards in professional anti-static packaging

Standard maintenance effectively improves equipment operation stability and reduces unexpected production shutdowns.

Product Advantages

• Customized for Lam Research original semiconductor equipment
• Fully compatible with mainstream VME control architectures
• Stable signal communication and precise signal distribution capability
• Modular plug-and-play replacement solution, easy to operate
• Ideal for legacy semiconductor equipment maintenance and upgrade
• Significantly improves control system stability and production efficiency
• Effectively reduce equipment failure rate and production downtime
• Suitable for enterprise spare parts inventory management

Industrial Supply Support

We provide genuine Lam Research 810-800081-022 VME Backplane PCB Assemblies and 810-800082-201 VME Breakout Assemblies. We also offer a full range of semiconductor equipment spare parts, including control boards, CPU modules, I/O boards, power assemblies, interface cards and other electronic control components for industrial semiconductor production and maintenance.

------------------------------------------------------------------------------------------------------------------------------

Many products have not been listed yet. Please contact us for more products

📧 sales5@xrjdcs.com |  📞 +86 18250705533（WhatsApp）丨Sales Manager： Jinny  

Main brand

ABB 丨 GE 丨Allen Bradley  丨  Honeywell 丨   Emerson  丨  Bently Nevada   丨 Westinghouse  

Triconex  丨Foxboro 丨   ICS Triplex  丨  Hima  丨  Schneider 丨  Yokogawa  丨 Woodward  & more

⇒The following are our main activities
Taken the ABB (AC800M/AC800F/AC800PEC/AC900F/excitation control)
★GE VMIVME/ VMIC series CPU mainboard
Relay protection SR469/SR369/SR489/SR750
IS200/IS215/IS220/ IS420/ DS200/DS215
/IC693/IC694/IC695/IC697/IC698
★ Invensys (3008, 3625, 3508E.3721, 3700A 4351B Safety system module)
★ Bentley (3500/42M, 3500/22M, 3500/95.3500/05)
★ Woodward 9907 series 505 governor, 8840 series controller, module
★ Foxboro (FBM230, FBM232, FCP270, H90/H92)
★ Emerson Westinghouse module 1C311/1C312, DELTAV module EPRO sensor
★ Dark Horse (F3330, F3236, F6217, F7126, F8621A)
★ Schneider Modicon 140 series CPU, communication module ELAU servo
★ Prosofte MVI46/56/69, AB, communication module